1. Kev tu: Ultrasonic tu ntawm PCB lossis LED bracket, ua raws li kev ziab.
2. Mounting: Tom qab siv nyiaj muab tshuaj txhuam rau hauv qab electrodes ntawm LED tuag (loj disc), nws yog nthuav. Qhov nthuav dav tuag (loj disc) tau muab tso rau ntawm lub tshuab sib txuas, thiab nyob rau hauv lub tshuab ntsuas, qhov tuag yog ib tus zuj zus rau ntawm cov ntaub qhwv sib xws ntawm PCB lossis LED bracket siv lub nplhaib sib txuas. Tom qab ntawd sintering yog ua los kho cov nyiaj muab tshuaj txhuam.
3. Hlau Bonding: Electrodes yog txuas nrog LED tuag siv aluminium lossis kub hlau bonding tshuab los ua tus coj rau kev txhaj tshuaj tam sim no. Rau LEDs ncaj qha mounted ntawm PCB, txhuas hlau txuas feem ntau yog siv.
4. Encapsulation: Epoxy resin yog siv los tiv thaiv LED tuag thiab kev sib txuas xov hlau. Cov duab ntawm cov kho epoxy resin siv rau PCB yog qhov tseem ceeb, cuam tshuam ncaj qha rau qhov ci ntawm lub teeb ci tiav. Cov txheej txheem no kuj suav nrog kev siv phosphor (rau cov LEDs dawb).
5. Soldering: Yog hais tias lub backlight siv SMD-LEDs los yog lwm yam pre-encapsulated LEDs, cov LEDs yuav tsum tau soldered mus rau lub PCB ua ntej los ua ke.
6. Kev txiav zaj duab xis: Siv cov xuas nrig ntaus kom tuag- txiav ntau cov yeeb yaj kiab diffusion, cov yeeb yaj kiab cuam tshuam, thiab lwm yam, xav tau rau lub teeb rov qab.
7. Kev sib dhos: Manually nruab ntau yam ntaub ntawv ntawm lub teeb pom kev zoo nyob rau hauv txoj haujlwm raug raws li cov duab kos.
8. Kev Ntsuas: Txheeb xyuas seb cov duab hluav taws xob tsis zoo thiab lub teeb emission uniformity ntawm lub teeb pom kev zoo.
9. Ntim: Ntim cov khoom tiav raws li qhov yuav tsum tau ua thiab muab tso rau hauv cia.